An unknown overclocker has shared a photo of a delidded Ryzen 7000 CPU online. This photo was published by TechPowerUp on their website. The photo shows the integrated heat spreader (IHS) of the upcoming chip.
It seems like AMD has already started sending out the Ryzen 7000 chips to overclockers. But, the chips are presumably still under embargo. Thus, the overclocker’s name has been kept unknown to prevent him from making it into AMD’s bad books.
The above photo is distinctly identifiable as a Ryzen 7000 CPU. AMD previously has shown as renders of the chip, and the one physical characteristic that stood out from the rest was the presence of several feet around the chip. This photo shows the imprints of the chip.
Also, looking at the photo, you will be able to tell the IHS is quite heavyweight. AMD is indeed stepping up their cooling game with the upcoming Ryzen 7000 processors as the company will need to handle processors that are significantly more hot running than the last-gen Zen 3 chips.
AMD also already has shared photos of how the Zen4 chips are going to look from the inside. The imprints on the leaked photo seem to support the layout the manufacturer had showcased earlier. These imprints also show that AMD is used metal solder instead of a paste compound as the thermal interface material (TIM).
Delidding has become a critical task these days as companies like Intel and AMD have started to solder the components to the IHS to facilitate more efficient heat transfer. Also, it remains unknown whether this enthusiast overclocker’s delid attempt was a success or if he ended up damaging some components or the other.
If this leak is genuine, we guess some heavy benchmarks are running on the Zen 4 CPUs from several enthusiast overclockers who got the chips. Thus, more leaks should be headed our way very soon.