AMD had a bunch of stuff to unveil at their Computex keynote today. CEO Dr. Lisa Su led the event, along with a bunch of other AMD officials. The company announced a new mobile chip, Smart Access Storage, and more information on the upcoming Ryzen 7000 series and the Zen 4 architecture was given.
AMD showed a demo of a 16-core Ryzen 7000 chip during the event. The chip was constantly hitting 5.5GHz while running Ghostwire: Tokyo. The Zen 4 processor also completed a Blender render 31% faster as compared to the 12900K.
AMD claimed that these new processors will come with >15% more single-thread performance than the Ryzen 5000 processors. They also have designed the Ryzen 7000 processors to be clocked at extremely high clock speeds. These processors will come equipped with RDNA2 graphics processors, unlike the GCN 5th generation chips the company was using till the Ryzen 5000 series. The chips will also come with DDR5 memory and PCIe Gen5 support. The Ryzen 7000 series is using a 5nm process node for its CPU chiplets and a 6nm process node for its I/O die. They are also coming with 1MB of L2 cache per core, essentially doubling the count from the last generation.
With the Ryzen 7000 series of processors, the company is also introducing a new Southbridge chip series. This new lineup will be called the X670E (Extreme). The X670E motherboards will be coupled with the regular X670 and B650 motherboards for now.
The new AM5 socket is shifting towards LGA from the micro PGA layout its predecessor used. This socket will also support up to 170W of peak power, allowing the Ryzen 7000 series to utilize the performance per watt number more effectively.
Alongside these launches, the company also unveiled some motherboard designs partners like Biostar, MSI, and Gigabyte have come up with.